Copper sulfate plating additive "Lucent Copper SVF"
Copper sulfate plating additive with low film thickness and high filling ability!
"Lucent Copper SVF" is a copper sulfate plating additive for printed circuit boards. It excels in filling performance and throwing power in high current density areas compared to conventional additives, providing a reliable plating film on boards with mixed vias and through holes. [Features] - High filling capability with low film thickness - Compatible with boards with mixed through holes - Suitable for high current density *For more details, please refer to the PDF document or feel free to contact us.
- Company：メルテックス
- Price：Other
